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NXP Semiconductors
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD protection diodes
4. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V RWM
Parameter
reverse standoff voltage
Conditions
IP4085CX4; IP4386CX4
IP4385CX4
IP4387CX4
Min
? 0.5
? 0.5
? 0.5
Max
+14
+5.5
+8.0
Unit
V
V
V
V ESD
electrostatic discharge voltage
all pins to ground
contact discharge
air discharge
[1]
[1]
? 30
? 15
+30
+15
kV
kV
IEC 61000-4-2, level 4;
all pins to ground
I PP
I FSM
peak pulse current
non-repetitive peak forward
current
contact discharge
air discharge
IEC 61000-4-5; t p = 8/20 ? s
IP4085CX4
IP4385CX4; IP4387CX4
IP4386CX4
10 pulses; 1 pulse per
second
IP4085CX4; IP4386CX4;
? 8
? 15
60
33
28
10
+8
+15
-
-
-
-
kV
kV
A
A
A
A
t p = 2 ms
IP4085CX4; IP4386CX4;
8.5
-
A
t p = 5 ms
IP4085CX4; IP4386CX4;
3.5
-
A
t p = 100 ms
IP4385CX4; IP4387CX4;
11
-
A
t p = 2 ms
IP4385CX4; IP4387CX4;
9
-
A
t p = 5 ms
IP4385CX4; IP4387CX4;
5
-
A
t p = 100 ms
P tot
total power dissipation
forward conducting
[2]
IP4085CX4
IP4385CX4; IP4386CX4;
[3]
[3]
-
-
1
0.7
W
W
IP4387CX4
T stg
storage temperature
? 55
+150
? C
T reflow(peak)
T amb
peak reflow temperature
ambient temperature
t p ? 10 s
-
? 30
260
+85
? C
? C
[1]
[2]
[3]
Device tested with over 1000 pulses of ? 30 kV contact discharges, according to the IEC 61000-4-2 model.
Severe self-heating demands a heat-dissipation optimized Printed-Circuit Board (PCB) to prevent the device from de-soldering. For
ambient temperature above 50 ? C, the guaranteed life time is 48 hours at 0.7 W, assuming R th to be 130 K/W as specified in Table 4 .
Permanent operation at maximum power dissipation and above maximum junction temperature will result in a reduced life time.
IP4085_4385_4386_4387_CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2012
? NXP B.V. 2012. All rights reserved.
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